Page 17 - Smartphone Technician - TP - Hindi

Bluetooth, data cable, OTG, Concept of Android and windows
card reader, etc. (10 hrs) technology in mobile system.
32 Perform assembling and Basic features of Android &
disassembling of windows and its applications.
Smartphone using different Functions of Smartphone
tools. (10 hrs)
33 Demonstrate process of components.
password cracking. (08 hrs) Concept of Wi-Fi.
34 Install various Operating Downloading through internet,
Systems (OS) in mobile share with Blue tooth, share
phones. (05 hrs) internet via hotspot, Data cable
35 Perform Reboot procedure. & Card reader, concept of OTG,
(05 hrs) NFC.
Study Various tools and
equipment used in Smartphone
repairing.
Concept of different type of IC
that is used in Smartphone
(windows and android).
Different kind of application that
is used in windows and android.
Android Mobile recovery
procedure through coding.
Windows mobile recovery
procedure through coding.
Techniques of crack password
code of windows and android
mobile phone.
Procedure of reboot (window and
android). Overview of BTS, MTS
(12 hrs)

Identify defects in 36 Practice setting different Testing of various parts and
Professional parameters for proper use of components that are used in
Skill 48 Hrs; Smartphones, replace
faulty components and various machine viz., blower, mobile phone for hardware
perform testing. DC power supply, charging repairing.
Professional booster machine etc. (07
Knowledge 12 (Maps NOS: ELE/N8107) hrs) Recognize and troubleshoot
Hrs common handset problems like
37 Demonstrate SMD rework hanging issues, camera problems.
station and BGA IC Study various radiation
Reballing and Installing. (07
hrs) Levels of Smartphone.
38 De-solder and remove the Study Compliance standards for
BGA IC from the PCB and mobile phones in India.
clean the solder from the Study Mobile phone hardware
bottom of the IC. (08 hrs) troubleshooting procedure
39 Practice use of different (hanging, USB charging & touch
soldering iron (10W & 25W) sensor problems).
and de-soldering wire or Concept of Ultrasonic cleaning.
wick. (06 hrs)
40 Replace various ICs on Overview of SMD rework station
mobile handsets. (05 hrs) Overview of BGA, BGA
41 Identify damages from Soldering.
ingress of water and IC Reballing and Installation.
practice to resolve. (04 hrs) Concept of Power failure of
42 Analyze the hanging issues mobile phone and process to
and practice to resolve it. (03 solve it. (dead handsets) (12 hrs)
hrs)

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